Electronic Packaging Materials - Page 1 of 3
Electronic Packaging Material
A low stress alternative for advanced electronic packaging, NuSil Technology's Electronic Packaging Materials (EPMs) allow the designer to choose from a unique line of silicones for various levels of packaging. Packaging options include a variety of products from Flip Chip Under Fill to Glob Top.
Silicone's unique chemical composition compared to organic based polymers applies lower shear stress on components during heating and cooling. Lower applied shear stress can be used in applications where hybrid packages utilize materials with various Coefficients of Thermal Expansion (CTE). Silicones offer stress relief during thermal cycling.
NuSil has over 25 years experience as a custom formulator. Our laboratories will tailor any of our materials to meet your specific property requirements. In addition, our high-performance silicone materials set the standard for quality, reliability and consistency. No matter how large or small the batch, NuSil guarantees the same high-quality care and commitment to excellence - that's a promise. Next Page->
