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For full Warranty details please refer to the product profile!
Electronic Packaging Material - Potting and Encapsulating Materials
Details: EPM-2423 - Legacy material used for adhering solvent cells to composite substrates
| Product Profile: | EPM-2423P.pdf |
|---|---|
| MSDS PDF A: | EPM2423A.pdf |
| MSDS PDF B: | EPM2423B.pdf |
Basic Product Overview: |
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| Section: | Electronic Packaging Material |
| Description: | Potting and Encapsulating Materials |
| NuSil ID: | EPM-2423 |
| Flow/Viscosity: | 8000 cP |
| Cure System: | Platinum |
| Work Time: | 2 H |
| Cure Time/Temp: | 15 M / 150 |
| Specific Gravity: | 1.02 |
| Durometer Type A Typical: | 50 |
| Tensile psi Typical: | 1000 |
| Tensile MPa Typical: | 6.9 |
| Elongation Percent Typical: | 125 |
| Lap Shear psi/Mpa: | 400/2.8 |
| Mix Ratio: | 10:1 |
| Colour: | Clear |
| Comments: | Legacy material used for adhering solvent cells to composite substrates |
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Back | Please note: Alternative sizes and packaging can and may be supplied, subject to availability of stock. Products pictured may vary and illustrations are for guidance only! |
